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Capabilities

Core engineering capabilities

Multi-disciplinary, with the depth to build a whole electronic product — from register-level firmware, high-speed PCB, mechanical and manufacturing, through to software and cloud.

Embedded Firmware Engineering

Embedded Firmware Engineering

Firmware across many MCU families, from bare-metal and RTOS to embedded Linux — mastered down to the register, not just library calls.

  • Cortex-M0/M3/M4/M7 (STM32, SAM, nRF, ESP32), PIC/AVR/dsPIC 8–16-bit
  • Register-level Cortex-M: NVIC, MPU, Thumb-2, SysTick/DMA, JTAG/SWD debug
  • Bare-metal, FreeRTOS, Zephyr, ChibiOS; C/C++/Assembly/Rust; GCC ARM, Keil, IAR, ESP-IDF
  • Memory-safe code, fault-tolerant state machines, watchdog recovery, power-aware, DMA
Embedded Linux & BSP

Embedded Linux & BSP

Deep embedded Linux capability, from bootloader to kernel — a rare skill set in the Vietnamese market.

  • Kernel porting/customization for custom hardware; kernel debug (kgdb, ftrace, JTAG)
  • Device drivers: character/platform, I2C/SPI/UART/USB, Linux-model network drivers
  • BSP bring-up from bootloader to kernel; U-Boot porting; Device Tree (DTS/DTB); clock/pinmux
  • Custom Linux distributions with Yocto/OpenEmbedded and Buildroot
Hardware Design & High-Speed Digital

Hardware Design & High-Speed Digital

Schematic and PCB layout for mixed-signal, RF and high-speed digital — designed so it can be measured and verified.

  • High-speed: 10G Ethernet (XFI/SFI), multi-gigabit SerDes, SFP+/SFP, USB 3.0, PCIe, DDR3/4
  • Signal & power integrity: controlled impedance, length/skew matching, eye diagram, jitter, PDN
  • PCB 2L–12L+, stack-up & impedance control, via optimization, EMC/EMI, DFM (Altium, KiCad)
  • Verified with oscilloscope, logic analyzer, spectrum analyzer and thermal imaging
Wireless Mesh Communications

Wireless Mesh Communications

A core strength: multi-node mesh that self-forms, self-heals and tolerates faults — including time-synchronized mesh for deterministic communication.

  • Multi-node IoT mesh over MQTT; LoRa-based mesh for long-range deployments
  • Custom routing algorithms; self-forming and self-healing protocols; time synchronization
  • Secure mesh with end-to-end encryption and authentication
  • Mesh-to-cloud bridging via gateway architecture
Vehicle Electronics & Automotive

Vehicle Electronics & Automotive

ECU and CAN network design for motorcycles and cars — automotive-grade reliability under real operating conditions.

  • ECU design; CAN/CAN-FD, LIN, OBD-II, J1939; multi-node vehicle networks
  • Sensor integration (IMU, GPS); high-speed trip data logging
  • OTA firmware updates for fleets in operation
  • Automotive-grade: -40°C to +85°C, vibration/shock, EMI immunity, 10+ year lifetime
Mechanical & Enclosure Design

Mechanical & Enclosure Design

Mechanical tied to electronics — from PCB to a complete ruggedized enclosure, with thermal simulation.

  • 3D SolidWorks design; sheet metal, CNC machining; aluminium 6061-T6, composites
  • Thermal management: conduction cooling (fanless), heat sinks, TIM, thermal sim & junction analysis
  • Ruggedization: IP65/IP67 sealing, gaskets, MIL-DTL-38999 military connectors
  • Shock and vibration isolation for harsh environments
Environmental & Reliability Engineering

Environmental & Reliability Engineering

Reliability and environmental qualification are core requirements from the design stage, not a final check.

  • -40°C to +85°C range; humidity, salt fog, dust/sand resistance; altitude operation
  • Designed to MIL-STD-810 (environmental) and MIL-STD-461 / EN 55022-24 (EMC/EMI)
  • MTBF prediction, FMEA, thermal soak, burn-in, stress testing
  • Coordination with accredited labs for formal testing and certification
Manufacturing & Production

Manufacturing & Production

Real manufacturing experience — rare for an engineering studio — to carry a design from R&D prototype to mass production.

  • SMT line operation, quality control, defect and yield analysis
  • DFM from the design stage; BOM and component-cost optimization
  • Supply-chain management, component sourcing (non-China for sensitive projects)
  • Pre-production prototyping, pilot-batch coordination, production validation
System Integration

System Integration

Multi-component integration, including proven COTS cores, combined with custom hardware/mechanical.

  • COTS module integration onto self-designed carrier boards (power, I/O, PoE, mounting)
  • Multi-board systems: backplane, board-to-board connectors
  • Hardware + firmware bring-up; OS integration (Linux, RTOS)
  • Interface design and verification; system-level and acceptance testing
Full-Stack Software Engineering

Full-Stack Software Engineering

The full software stack from firmware to cloud — backend, frontend, mobile, DevOps and Edge AI.

  • Backend: C#/.NET, Go, Python, Node.js; SQL (PostgreSQL, MySQL, SQL Server)
  • Frontend & Mobile: React, Vue, Swift (iOS), Kotlin/Java (Android), Flutter
  • Infrastructure: Docker, AWS/GCP/Azure, CI/CD, self-hosted for sensitive deployments
  • Edge AI: TensorFlow Lite, ONNX; blockchain & smart contracts; secure boot, cryptographically-verified OTA